Donglu Shi – Materials science – Best Researcher Award

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Donglu Shi – Materials science – Best Researcher Award

Prof Dr. Donglu Shi distinguished academic and researcher in the field Material Science.  He has held various esteemed positions throughout his career. Since 2001, he has served as a Professor of Materials Science and Engineering at the University of Cincinnati in Cincinnati, Ohio, United States. Additionally, from 2013 to 2023, he assumed the roles of Chair and Graduate Director of Materials Science and Engineering at the same institution.

His international experience includes a stint as a Visiting Scientist at the Centre National de la Recherche Scientifique in Grenoble, Dauphiné, France, in 2001. Furthermore, in the same year, he was a Fellow at Fitzwilliam College, University of Cambridge, Cambridge, Cambridgeshire, United Kingdom.

Prior to his professorial role, he held the position of Associate Professor at the University of Cincinnati’s Department of Materials Science and Engineering from 1995 to 2001. Earlier in his career, he worked as a Staff Scientist in the Materials Science Division of Argonne National Laboratory, based in Argonne, Illinois, United States, from 1988 to 1995. Preceding this, he served as a Postdoctoral Staff member at the same institution from 1987 to 1988.

🌐 Professional Profiles

Educations📚📚📚

He received his Master of Science in Physics from the University of Massachusetts, Amherst, MA, USA, in May 1983. Following this, he pursued his Doctor of Philosophy (PhD) in Engineering from the same institution, completing it in September 1986. Subsequently, he joined Argonne National Laboratory in Lemont, Illinois, United States, as a Postdoctoral Fellow from July 1987 to September 1988, specializing in Materials Science.

Synergistic Activities

He is actively engaged in teaching and research at the University of Cincinnati, where he teaches undergraduate courses in materials science and graduate courses in solid-state physics. Additionally, he oversees the minor degree programs in Nano Engineering and Materials Engineering.

As part of his commitment to STEM education, he participates in the Summer Institute at the University of Cincinnati, delivering lectures on nanoscience to groups of underrepresented students.

His research endeavors are groundbreaking, focusing on nanoscience, photonics, and magnetism. He investigates the electronic structures of nanomaterials, particularly emphasizing 3D solar harvesting and energy generation. Through his innovative work, he contributes to the development of novel devices, aiming to achieve a net-zero carbon footprint and promote environmental sustainability. Furthermore, he explores the applications of biomaterials in medical diagnosis and therapy.

His contributions to the field have been recognized through various prestigious honors and awards, including being named a Fellow of ASM-International and a Visiting Fellow of Fitzwilliam College, Cambridge University. He has also received accolades such as the Rieveschl Award for Distinguished Scientific Research, the Sarah Grant Barber Outstanding Faculty Advisor Award, the Distinguished Engineering Researcher Award, the Neil Wandmacher Teaching Award, the SIGMA XI Research Recognition Award, and the Honor Roll Professor of Excellence in Teaching Award. Moreover, he has been appointed to editorial positions for several prominent journals, including serving as Editorial Board Member of Journal of Energy and Power Technology, Associate Editor of Nanomaterials, Editor-in-Chief of Nano LIFE, Associate Editor of Nanomaterials, and Editorial Board Member of Biomaterials Advances and Bioengineering.

📝🔬Publications📝🔬

Chabum Lee – Semiconductor – Industry Impact Award

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Prof dr. Chabum Lee distinguished academic and researcher in the field   Semiconductor.  He has conducted research on piezoelectric polymer poling processes using additive manufacturing techniques, water contaminant sensors utilizing magnetic/optical spectroscopy, and impedance spectroscopy for in-process manufacturing process controls.

In terms of academic positions, he has served as both an Associate Professor and Assistant Professor at Texas A&M University, focusing on semiconductor metrology and high-temperature atomic force microscopy, among other topics. He has also co-founded LABPISODE LLC., where he has contributed to the development of high-precision scanners and engineering lab modules, particularly in the semiconductor microscopy domain.

Furthermore, he has held positions as a Visiting Researcher at the National Institute of Standards and Technology (NIST), concentrating on prognostics and health monitoring of robotic manufacturing systems and machine learning for sensor self-calibration. Earlier in his career, he served as an Assistant Professor at Tennessee Tech University and as an Assistant Research Professor at the University of South Carolina, where he worked on dimensional measurement, sensor development, and nanomanufacturing for various engineering applications.

 

🌐 Professional Profiles

Educations📚📚📚

He earned his Bachelor of Science in Mechanical Engineering from Chung-Ang University in Seoul, South Korea, in February 2006. Following this, he pursued his Master of Science in Mechatronics at the Gwangju Institute of Science and Technology, also in South Korea, completing his degree in February 2008. Subsequently, he continued his academic journey at the same institution, earning his Ph.D. in Mechatronics in February 2012.

 

Research Interest

He has extensive research experience in various fields, particularly in the realm of mechanical engineering and semiconductor technology. His expertise encompasses semiconductor metrology for photomask, pellicle, wafer, and via inspection, as well as intelligent spindle monitoring for machining processes. He has also worked on fiber optics for optical freeform surface measurement, edge topography measurement for semiconductor lithography, and material-laser interaction in laser-assisted machining processes.

🏆🏆HONORS AND AWARDS🏆🏆

He has received numerous awards and recognitions for his outstanding contributions to the field of mechanical engineering and precision technology. These accolades include the 2022 Emerging Leaders 2022 award from the Institute of Physics (IOP) publication, Surface Topography: Metrology and Properties. In 2020, he was honored with the prestigious Blackall Machine Tool and Gage Award by the American Society of Mechanical Engineers (ASME).

Furthermore, he received the Alumni Award from the Gwangju Institute of Science and Technology in 2019, recognizing his achievements and contributions to the academic community. His research excellence was acknowledged with the Best Research Award at the American Society for Precision Engineering Conference in 2017, as well as the Kinslow Research Award and the Research and Economic Development Award from Tennessee Tech University in the same year.

Earlier in his career, he was distinguished with the Best Award of Graduation in 2012 from the Gwangju Institute of Science and Technology, along with the Best Award for Excellence in Research from the Korea Institute of Machinery & Materials. Additionally, he received the Best Paper Award from the Korean Society for Precision Engineering in 2012, further affirming his significant contributions to the field.

WORK EXPERIENCE 

He has engaged in various synergistic activities that complement his research and academic endeavors. As an Associate Editor, he has contributed to three prestigious journals: the International Journal of Precision Engineering and Manufacturing since 2018, the Journal of Manufacturing and Materials Processing since 2020, and the International Conference on Micro- and Nano-devices Enabled by R2R Manufacturing since 2021. Additionally, he has served as an Editor in Special Topics for two journals: the Journal of Manufacturing Materials and Processes (focused on Machining Processes) and the ASME Journal of Manufacturing Science and Engineering (focused on Semiconductor Manufacturing).

His active involvement in academic memberships includes ASPE (American Society for Precision Engineering) since 2009, ASME (American Society of Mechanical Engineers) since 2020, KSPE (Korean Society for Precision Engineering) since 2006, and ASEE (American Society for Engineering Education) from 2021 to 2023.

Moreover, he has significantly contributed to the academic community as a peer-reviewer for numerous journals and papers spanning various disciplines such as manufacturing engineering, measurement, optics, and materials science.

Dr. Lee has also played key roles in conference activities, serving on technical program committees for esteemed conferences such as the American Society for Precision Engineering, International Conference on Material Strength and Applied Mechanics, Sensors and Actuators, and others.

In terms of proposal review activities, he has participated in reviewing proposals for prestigious funding agencies and programs such as the NSF Advanced Manufacturing Program, NSF SBIR Program, ACS (American Chemical Society), and the National Research Foundation of Korea.

Furthermore, he has been actively engaged in service roles within his academic and departmental communities, including participation in committees, coordination of courses, and advisory roles for student organizations.

In his teaching endeavors, he has imparted his knowledge and expertise to students at Texas A&M University and Tennessee Technological University, covering courses on precision machine tools, engineering laboratory work, capstone design, mechanical measurements, numerical methods, and more.

Book Chapter 

ChaBum Lee, Large-range nano-scanning devices based on optical sensing technology, Book
chapter, Advanced Mechatronics and MEMS Devices II, Springer 2017: 10.1007/978-3-319-
32180-6_22 2017.

Conferences

Dr. ChaBum Lee has been actively engaged in presenting his research findings at various prestigious conferences and symposiums worldwide. His presentations cover a wide range of topics, including metrology, inspection, machining processes, additive manufacturing, and material characterization. Notably, he has been invited to deliver talks at several international symposiums, showcasing his expertise in via metrology and inspection for advanced electronics packaging.

At the 21st International Symposium on Microelectronics and Packaging in October 2023 in Busan, Korea, Dr. Lee presented on “Via Metrology and Inspection for Advanced Electronics Packaging” as an invited speaker. He also delivered an invited talk on “Wafer-Level Metrology and Inspection for Advanced Electronics Packaging” at the International Symposium on Measurement Technology and Intelligent Instrument 2023 in September 2023 in Seoul, Korea.

Furthermore, Dr. Lee has contributed to numerous conferences in the USA, presenting research papers and findings. For instance, he presented on “A Fringe Pattern Analysis Technique for Photomask Line-Edge-Roughness Characterization” at the ASME 2023 18th International Manufacturing Science and Engineering Conference in June 2023 in New Brunswick, NJ. Additionally, he co-authored presentations on topics such as “Curved-edge diffraction fringe pattern analysis for wafer edge metrology and inspection” and “Metallurgical property profiling of machined surface layer for microstructural prediction in subtractive and additive manufacturing” at various conferences, demonstrating his multidisciplinary expertise.

Dr. Lee’s active participation in conferences reflects his commitment to sharing his research findings, exchanging knowledge with peers, and contributing to advancements in precision engineering, manufacturing science, and related fields.

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